The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Mar. 30, 2020
Applicant:

Te Connectivity Services Gmbh, Schaffhausen, CH;

Inventor:

Matthew Ryan Schmitt, Middletown, PA (US);

Assignee:

TE CONNECTIVITY SERVICES GmbH, Schaffhausen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H05K 9/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20445 (2013.01); H01L 23/552 (2013.01); H05K 9/0026 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A board level shield includes shield walls forming a shield chamber sized and shaped to receive an electrical component mounted to a host circuit board. The shield walls provide electrical shielding entirely around the shield chamber for the electrical component. The shield walls extend between a top and a bottom configured to be mounted to the host circuit board and connected to a ground layer of the host circuit board. The board level shield includes a shield opening at the top bounded by the shield walls and sized and shaped to receive a thermal bridge to allow the thermal bridge to extend through the shield opening to interface with the electrical component. The board level shield includes shield fingers extending from the shield walls into the shield opening. The shield fingers are configured to engage the thermal bridge at separable mating interfaces to electrically connect the shield fingers to the thermal bridge.


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