The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Apr. 24, 2019
Applicants:

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Xingjun Shu, Beijing, CN;

Jianwu Wu, Beijing, CN;

Xi Chen, Beijing, CN;

Xinda Li, Beijing, CN;

Shengwei Yang, Beijing, CN;

Yadong Zhang, Beijing, CN;

Jianye Tang, Beijing, CN;

Jiaqiang Wang, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/06 (2006.01); H05K 3/12 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H01L 21/02 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 21/607 (2006.01); H01L 23/02 (2006.01); H01L 23/06 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/42 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/0237 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 1/118 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); H05K 2201/056 (2013.01); H05K 2201/10128 (2013.01);
Abstract

The present disclosure provides a circuit board, including a substrate on which a first conductive layer and an electronic device are disposed, wherein the first conductive layer is disposed on a first surface of the substrate, and wherein a bottom end of the electronic device is disposed on the first conductive layer through the substrate. The present disclosure provides a display device.


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