The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Dec. 18, 2019
Applicant:

Fujifilm Business Innovation Corp., Tokyo, JP;

Inventors:

Kazuhiro Sakai, Kanagawa, JP;

Daisuke Iguchi, Kanagawa, JP;

Takeshi Minamiru, Kanagawa, JP;

Yoshinori Shirakawa, Kanagawa, JP;

Tomoaki Sakita, Kanagawa, JP;

Tsutomu Otsuka, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/42 (2006.01); H01S 5/02255 (2021.01); H01S 5/02325 (2021.01); H01S 5/068 (2006.01); H01S 5/0687 (2006.01); H01S 5/042 (2006.01); H01S 5/02 (2006.01); H01S 5/183 (2006.01); H01S 5/30 (2006.01); H01S 5/343 (2006.01); H01S 5/20 (2006.01); G02B 27/42 (2006.01); G02B 5/02 (2006.01); G06K 9/00 (2006.01); G06K 9/20 (2006.01);
U.S. Cl.
CPC ...
H01S 5/423 (2013.01); G02B 5/0278 (2013.01); G02B 27/4205 (2013.01); G06K 9/00201 (2013.01); G06K 9/00255 (2013.01); G06K 9/2036 (2013.01); H01S 5/02255 (2021.01); H01S 5/02325 (2021.01); H01S 5/0687 (2013.01); H01S 5/06804 (2013.01); H01S 5/0206 (2013.01); H01S 5/04252 (2019.08); H01S 5/04254 (2019.08); H01S 5/18347 (2013.01); H01S 5/18361 (2013.01); H01S 5/2054 (2013.01); H01S 5/3054 (2013.01); H01S 5/34353 (2013.01);
Abstract

A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.


Find Patent Forward Citations

Loading…