The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Dec. 26, 2019
Applicant:

Playnitride Display Co., Ltd., Miaoli County, TW;

Inventors:

Yi-Ching Chen, Miaoli County, TW;

Pei-Hsin Chen, Miaoli County, TW;

Yi-Chun Shih, Miaoli County, TW;

Tzu-Yang Lin, Miaoli County, TW;

Yu-Hung Lai, Miaoli County, TW;

Assignee:

PLAYNITRIDE DISPLAY CO., LTD., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 21/6835 (2013.01); H01L 22/22 (2013.01); H01L 25/0753 (2013.01); H01L 2221/68368 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method for fabricating a micro light-emitting diode display is provided. The method includes disposing a plurality of micro light-emitting diodes on a carrier; transferring the micro light-emitting diodes from the carrier to a display substrate and disposing the micro light-emitting diodes in a plurality of pixels of the display substrate; subjecting the micro light-emitting diodes to a pre-bonding process to electrically connect the micro light-emitting diodes to the display substrate; subjecting the micro light-emitting diodes pre-bonded to the display substrate to a first detection process, thereby identifying whether a faulty micro light-emitting diode is present or not; and, subjecting the micro light-emitting diodes to the main bonding process after the first detection process.


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