The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Feb. 06, 2018
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Haejong Cho, Seoul, KR;

Donghae Oh, Seoul, KR;

Juhwa Cheong, Seoul, KR;

Junyong Ahn, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0224 (2006.01); H01B 1/16 (2006.01); C03C 8/18 (2006.01); C03C 4/14 (2006.01); C03C 8/10 (2006.01); H01L 31/0216 (2014.01); H01L 31/0368 (2006.01); H01L 31/068 (2012.01); H01L 31/0236 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/022425 (2013.01); C03C 4/14 (2013.01); C03C 8/10 (2013.01); C03C 8/18 (2013.01); H01B 1/16 (2013.01); H01L 31/02167 (2013.01); H01L 31/02168 (2013.01); H01L 31/02363 (2013.01); H01L 31/03682 (2013.01); H01L 31/068 (2013.01); C03C 2204/00 (2013.01); C03C 2205/00 (2013.01); H01L 31/1864 (2013.01); Y02E 10/50 (2013.01);
Abstract

A solar cell is disclosed. The solar cell includes a first conductive region positioned at a front surface of a semiconductor substrate and containing impurities of a first conductivity type or a second conductivity type, a second conductive region positioned at a back surface of the semiconductor substrate and containing impurities of a conductivity type opposite a conductivity type of impurities of the first conductive region, a first electrode positioned on the front surface of the semiconductor substrate and connected to the first conductive region, and a second electrode positioned on the back surface of the semiconductor substrate and connected to the second conductive region. Each of the first and second electrodes includes metal particles and a glass frit.


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