The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2021
Filed:
Sep. 30, 2020
Guangdong University of Technology, Guangdong, CN;
Yun Chen, Guangdong, CN;
Shuquan Ding, Guangdong, CN;
Yunbo He, Guangdong, CN;
Maoxiang Hou, Guangdong, CN;
Xin Chen, Guangdong, CN;
Jian Gao, Guangdong, CN;
Ni Zhao, Guangdong, CN;
Lanyu Zhang, Guangdong, CN;
Zhengping Wang, Guangdong, CN;
GUANGDONG UNIVERSITY OF TECHNOLOGY, Guangzhou, CN;
Abstract
A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.