The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2021
Filed:
Jan. 19, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Isao Oshima, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/52 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 24/32 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83051 (2013.01); H01L 2224/83141 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01);
Abstract
A first alignment resin () is formed in an annular shape on an electrode () of an insulating substrate (). First plate solder () having a thickness thinner than that of the first alignment resin () is arranged on the electrode () on an inner side of the annular shape of the first alignment resin (). A semiconductor chip () is arranged on the first plate solder (). The first plate solder () is made to melt to bond a lower surface of the semiconductor chip () to the electrode ().