The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Jan. 29, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Eric J. Bergman, Kalispell, MT (US);

John L. Klocke, Kalispell, MT (US);

You Wang, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 7/12 (2006.01); C25D 21/14 (2006.01); H01L 21/288 (2006.01); C25D 5/10 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2885 (2013.01); C25D 3/38 (2013.01); C25D 5/10 (2013.01); C25D 7/123 (2013.01); C25D 21/14 (2013.01); H01L 21/76843 (2013.01);
Abstract

Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operation and a second bath configured to maintain an anolyte during operation. The electroplating systems may include a catholyte tank and an anolyte tank fluidly coupled with the two baths of the two-bath electroplating chamber. The electroplating systems may include a first pump configured to provide catholyte from the catholyte tank to the first bath. The electroplating systems may include a second pump configured to provide anolyte from the anolyte tank to the second bath. The electroplating systems may also include an oxygen-delivery apparatus configured to provide an oxygen-containing fluid within the electroplating system.


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