The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2021
Filed:
Sep. 20, 2018
Tdk Corporation, Tokyo, JP;
Yusuke Nagai, Tokyo, JP;
Takashi Suzuki, Tokyo, JP;
Hidekazu Sato, Tokyo, JP;
Takashi Endo, Tokyo, JP;
Kouichi Kakuda, Tokyo, JP;
Kunihiko Kawasaki, Tokyo, JP;
Shinichi Kondo, Tokyo, JP;
Yuya Ishima, Tokyo, JP;
Shinichi Sato, Tokyo, JP;
Masaki Takahashi, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
Abstract
In a stepwise structure formed in a multilayer coil component, a difference occurs in a shrinkage amount between a maximum film thickness portion in which the number of layers is large and a minimum film thickness portion in which the number of layers is small due to portions different in the number of layers of coil parts (that is, upper coil part, lower coil part, and connecting part) adjacent to each other like the maximum film thickness portion and the minimum film thickness portion, readily causing a crack by an inner stress due to the difference in the shrinkage amount. In a multilayer coil component according to the present disclosure, a stress relaxation part overlapping with a maximum film thickness portion whose shrinkage amount is large is provided to relax inner stress in a stepwise structure, resulting in prevention of a crack.