The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Dec. 31, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Suk Youn Hong, Suwon-si, KR;

Jong In Ryu, Suwon-si, KR;

Seung Hyun Hong, Suwon-si, KR;

Jang Hyun Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 1/02 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1656 (2013.01); G06F 1/1698 (2013.01); H01L 23/10 (2013.01); H01L 23/3114 (2013.01); H05K 1/023 (2013.01);
Abstract

An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.


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