The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2021
Filed:
Jan. 25, 2018
Applicant:
The Chinese University of Hong Kong, Hong Kong, CN;
Inventors:
Shih-Chi Chen, Hong Kong, CN;
Xiangyu Fan, Hong Kong, CN;
Ni Zhao, Hong Kong, CN;
Yan Huang, Hong Kong, CN;
Ningqi Luo, Hong Kong, CN;
Assignee:
The Chinese University of Hong Kong, Hong Kong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 7/18 (2006.01); G01D 11/24 (2006.01); A61B 5/00 (2006.01); A61B 5/021 (2006.01);
U.S. Cl.
CPC ...
G01L 7/182 (2013.01); A61B 5/02108 (2013.01); A61B 5/681 (2013.01); G01D 11/245 (2013.01);
Abstract
A liquid encapsulation device for embedding sensor is provided. The liquid encapsulation device comprises a substrate having an upper surface with a central concave portion; at least one protection layer sealed on the upper surface of the substrate; and at least one sensor fixed on the protection layer. Wherein, the central concave portion is filled with liquid and the sensor is arranged above the central concave portion.