The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Jul. 09, 2018
Applicant:

Sika Technology Ag, Baar, CH;

Inventor:

Antonio Voci, Zürich, CH;

Assignee:

SIKA TECHNOLOGY AG, Baar, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01);
Abstract

A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 μm, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.


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