The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Oct. 24, 2015
Applicant:

Illinois Tool Works Inc., Glenview, IL (US);

Inventor:

Wells Cunningham, New Hartford, CT (US);

Assignee:

ILLINOIS TOOL WORKS INC., Glenview, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 4/06 (2006.01); C09J 5/00 (2006.01); C08G 18/81 (2006.01); C09J 175/16 (2006.01); B32B 37/12 (2006.01); C09J 9/00 (2006.01); C09J 11/06 (2006.01); C09J 4/00 (2006.01);
U.S. Cl.
CPC ...
C09J 4/06 (2013.01); B32B 37/12 (2013.01); C08G 18/8175 (2013.01); C09J 5/00 (2013.01); C09J 9/00 (2013.01); C09J 11/06 (2013.01); C09J 175/16 (2013.01); B32B 2457/00 (2013.01); C08G 2170/40 (2013.01); C09J 4/00 (2013.01); C09J 2203/318 (2013.01); C09J 2301/416 (2020.08); C09J 2433/00 (2013.01);
Abstract

A process for creating an assembly with a pressure sensitive adhesive includes the application of a light curable composition to a first substrate of the assembly. The light curable composition is cured with a single light exposure step to form a fully polymerized pressure sensitive adhesive. The resulting pressure sensitive adhesive is brought into contact with to a second substrate with sufficient force to bond the second substrate to the first substrate to complete the assembly with the pressure sensitive adhesive.


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