Addition-curable silicone resin composition and a semiconductor device

Abstract

An addition-curable silicone resin composition which exhibits good adhesion to a substrate and has good compatibility with an inorganic filler, as well as a cured product thereof and a highly reliable semiconductor device encapsulated with the cured product, are provided. The addition-curable silicone resin composition includes (A) a linear or branched organopolysiloxane having at least one alkenyl group, said organopolysiloxane comprising at least one unit selected from RRSiOand RRSiOunits, and at least one unit selected from RSiO, RSiOand RSiOunits, wherein a percentage of a total number of the RRSiOand RRSiOunits, relative to a total number of all siloxane units, is from 0.001% to 50%, and wherein Ris, independently at each occurrence, a hydroxy group or an alkoxy group of 1 to 30 carbon atoms; Ris, independently at each occurrence, a group selected from a substituted or unsubstituted saturated hydrocarbon group of 1 to 12 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group of 6 to 12 carbon atoms, an alkenyl group of 2 to 10 carbon atoms, and the groups as defined for R; and Ris a groups selected from the groups as defined for Rother than those as defined for R, with the proviso that at least one of Rand Ris an alkenyl group; (B) an organohydrogenpolysiloxane having at least two hydrosilyl groups, in an amount such that the ratio of the number of hydrosilyl groups in component (B) to a total number of alkenyl groups in component (A) is from 0.1 to 4; and (C) a catalytic amount of a hydrosilylation catalyst.