The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Jul. 30, 2019
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Javier E. Ramos, Brookline, MA (US);

Pitchaya Sitthi-Amorn, Cambridge, MA (US);

Wojciech Matusik, Lexington, MA (US);

Yuwang Wang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/386 (2017.01); B33Y 10/00 (2015.01); B29C 64/393 (2017.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/106 (2017.01); B29C 64/112 (2017.01);
U.S. Cl.
CPC ...
B29C 64/386 (2017.08); B29C 64/106 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B29C 64/112 (2017.08);
Abstract

The present application relates generally to systems and methods for using machine vision to provide information on one or more aspects of an additive fabrication device, such as calibration parameters and/or an object formed by the device or in the process of being formed by the device. According to some aspects, a method is provided for calibrating an additive fabrication device. According to some aspects, a method is provided for assessing at least a portion of an object formed using an additive fabrication device. According to some aspects, a method is provided for fabricating a second object in contact with a first object using an additive fabrication device. According to some aspects, an additive fabrication device configured to perform one or more of the above methods may be provided.


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