The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Sep. 20, 2018
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Jeffrey L. Mattlin, San Francisco, CA (US);

Abhijeet Misra, Sunnyvale, CA (US);

Herng-Jeng Jou, San Jose, CA (US);

James A. Wright, Los Gatos, CA (US);

James A. Yurko, Saratoga, CA (US);

Lei Gao, Shanghai, CN;

Weiming Huang, State College, PA (US);

William A. Counts, Sunnyvale, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 7/36 (2006.01); B29C 43/32 (2006.01);
U.S. Cl.
CPC ...
B28B 7/36 (2013.01); B28B 7/364 (2013.01); B29C 43/32 (2013.01);
Abstract

A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.


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