The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Jun. 12, 2020
Applicant:

Skc Solmics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Eun Sun Joeng, Ulsan, KR;

Jong Wook Yun, Gyeonggi-do, KR;

Hye Young Heo, Gyeonggi-do, KR;

Jang Won Seo, Gyeonggi-do, KR;

Assignee:

SKC solmics Co., Ltd., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); C08G 18/10 (2006.01); C08G 18/72 (2006.01); C08G 18/76 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); C08G 18/10 (2013.01); C08G 18/724 (2013.01); C08G 18/7621 (2013.01); H01L 21/30625 (2013.01);
Abstract

In the composition according to an embodiment, the weight ratio of toluene 2,4-diisocyanate in which one NCO group is reacted and unreacted toluene 2,6-diisocyanate in the urethane-based prepolymer is adjusted, whereby such physical properties as gelation time can be controlled. Thus, the polishing rate and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled while it has a hardness suitable for a soft pad, whereby it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.


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