The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Sep. 25, 2020
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventor:

Taku Ueno, Nara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01);
Abstract

A heat release device includes a housing, a substrate located within the housing, a heat source disposed on the substrate, a first member provided between the housing and the substrate and between the housing and the heat source, and a plurality of second members that support the first member from the substrate. The first member is disposed to have a gap with the heat source and so as to have a gap with the housing. Among the plurality of second members, a second member far from the heat source is larger in area in contact with the substrate and the first member than a second member close to the heat source.


Find Patent Forward Citations

Ueno, Taku. (2021). Heat release device (U.S. Patent No. 11206747). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11206747

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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