The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Dec. 19, 2019
Applicant:

Sz Dji Osmo Technology Co., Ltd., Shenzhen, CN;

Inventors:

Ping Wang, Shenzhen, CN;

Ting Wang, Shenzhen, CN;

Yongjie Huang, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H04N 5/225 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20154 (2013.01); H04N 5/22521 (2018.08); H05K 5/0213 (2013.01); H05K 7/20172 (2013.01); H05K 7/20181 (2013.01); H05K 7/20209 (2013.01);
Abstract

The embodiments of the present disclosure provide a heat dissipation structure, applied to an electronic device. The electronic device includes a power consumption element, and the power consumption element disposed in an accommodation cavity. The heat dissipation structure includes a cover, configured to cover and seal the accommodation cavity. The cover is thermally connected to the power consumption element through a heat-conducting element. The heat dissipation structure further includes a heat-dissipation component, thermally connected to the cover and including a heat-dissipation module and a fan. The heat-dissipation module is disposed in an air outlet channel of the fan, such that the wind generated by the fan takes away the heat of the heat-dissipation module.


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