The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Dec. 11, 2019
Applicant:
Hp Indigo B.v., Amstelveen, NL;
Inventors:
Dror Kella, Ness Ziona, IL;
Eyal Negreanu, Ness Ziona, IL;
Gideon Amir, Ness Ziona, IL;
Mark Sandler, Ness Ziona, IL;
Yaron Grinwald, Ness Ziona, IL;
Assignee:
HP Indigo B.V., Amstelveen, NL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); G03G 15/00 (2006.01); H05K 3/20 (2006.01); H05K 3/12 (2006.01); G03G 15/24 (2006.01);
U.S. Cl.
CPC ...
H05K 3/207 (2013.01); G03G 15/24 (2013.01); G03G 15/6585 (2013.01); G03G 15/6591 (2013.01); H05K 3/1266 (2013.01); H05K 2203/0517 (2013.01); H05K 2203/0522 (2013.01); H05K 2203/0528 (2013.01);
Abstract
In a method and an apparatus for forming on a substrate () a pattern of a material, a material layer is provided on an intermediate carrier () and an adhesive layer is provided on the material layer, wherein at least one of the material layer or the adhesive layer comprises a pattern corresponding to the pattern to be formed on the substrate (). The material is transferred to the substrate () with the adhesive fixing the material to a surface () of the substrate ().