The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Mar. 19, 2021
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/14 (2013.01); H05K 1/0218 (2013.01); H05K 1/181 (2013.01); H05K 9/0022 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09981 (2013.01); H05K 2201/2018 (2013.01);
Abstract
An interposer substrate includes a metal member; and a connection substrate disposed on at least portion of one side surface of the metal member. The connection substrate includes circuit patterns exposed from each of one surface of the connection substrate and the other surface of the connection substrate opposing the one surface, and one of a plurality of side surfaces of the connection substrate connecting one side and the other side of the connection substrate is attached to at least a portion of the one side surface of the metal member.