The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Jul. 23, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventor:

Bo Hyun Seo, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0224 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H05K 1/113 (2013.01); H05K 1/117 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/094 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/10545 (2013.01);
Abstract

A communication module includes: a substrate; a supplementary substrate disposed to surround an electronic element mounted on a lower surface of the substrate; a molding material configured to seal an electronic element mounted on an upper surface of the substrate; and a shielding layer disposed on a side surface and an upper surface of the molding material, a side surface of the supplementary substrate, and a side surface of the substrate. The supplementary substrate includes: a plurality of first pads disposed on an upper surface of the supplementary substrate; a plurality of second pads disposed on a lower surface of the supplementary substrate; a plurality of vias connecting the plurality first pads to the plurality of second pads; and a ground pad disposed on the side surface of the supplementary substrate. The ground pad includes an extender connected to a corresponding first pad and a corresponding second pad.


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