The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Apr. 16, 2018
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Roland Heinrich Enzmann, Gelugor, MY;

Hubert Halbritter, Dietfurt, DE;

Markus Bröll, Cork, IE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/0233 (2021.01); H01S 5/023 (2021.01); H01S 5/02 (2006.01); H01S 5/40 (2006.01); H01S 5/0235 (2021.01); H01S 5/042 (2006.01);
U.S. Cl.
CPC ...
H01S 5/023 (2021.01); H01S 5/021 (2013.01); H01S 5/0218 (2013.01); H01S 5/0233 (2021.01); H01S 5/0235 (2021.01); H01S 5/4025 (2013.01); H01S 5/04256 (2019.08); H01S 2301/176 (2013.01);
Abstract

A method of producing laser bars or semiconductor lasers includes providing a carrier composite to form a plurality of carriers for the laser bars or for the semiconductor lasers, providing a semiconductor body composite including a common substrate and a common semiconductor layer sequence grown thereon, forming a plurality of separation trenches through the common semiconductor layer sequence such that the semiconductor body composite is divided into a plurality of semiconductor bodies, applying the semiconductor body composite to the carrier composite such that the separation trenches face the carrier composite, thinning or removing the common substrate, and singulating the carrier composite into a plurality of carriers, wherein a plurality of semiconductor bodies are arranged on one of the carriers, and the semiconductor bodies arranged on one common carrier are laterally spaced apart from one another by the separation trenches.


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