The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Apr. 16, 2019
Applicant:
Toppan Printing Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
TOPPAN PRINTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/02 (2006.01); H01M 2/08 (2006.01); H01G 11/80 (2013.01); H01G 11/84 (2013.01); H01M 50/124 (2021.01); B32B 27/36 (2006.01); H01G 11/78 (2013.01); H01M 50/10 (2021.01); H01M 50/116 (2021.01); H01M 50/183 (2021.01);
U.S. Cl.
CPC ...
H01M 50/124 (2021.01); B32B 27/36 (2013.01); H01G 11/78 (2013.01); H01G 11/80 (2013.01); H01G 11/84 (2013.01); H01M 50/10 (2021.01); H01M 50/116 (2021.01); H01M 50/183 (2021.01); Y02E 60/13 (2013.01);
Abstract
A power storage device packaging material having a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. The substrate layer is formed of a polyester film exhibiting ΔA, as expressed by the following formula, of 10% or more and a 50% elongation stress of 75 MPa or more after heat treatment at 160° C.: 'ΔA=(break elongation after 160° C. heat treatment)−(break elongation before 160° C. heat treatment)'.