The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Feb. 03, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ashim Dutta, Menands, NY (US);

Ekmini Anuja De Silva, Slingerlands, NY (US);

Dominik Metzler, Clifton Park, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/22 (2006.01); H01L 43/12 (2006.01); H01L 43/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/222 (2013.01); H01L 43/02 (2013.01); H01L 43/12 (2013.01);
Abstract

Techniques for integrating an embedded MRAM device with a BEOL interconnect structure are provided. In one aspect, a method of forming an embedded MRAM device includes: depositing a cap layer onto a substrate; forming a metal line and metal pad on the cap layer; patterning the metal line to form first top vias, and the metal pad to form a second top via; depositing a dielectric material onto the substrate surrounding the first/second top vias; recessing the second top via to form a bottom contact via self-aligned to the metal pad which serves as a bottom contact; forming an MRAM cell over the bottom contact via; and forming first/second top contacts in contact with the first top vias/the MRAM cell. An embedded MRAM device is also provided.


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