The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Jan. 07, 2020
Applicant:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Inventors:

Adeel Ahmad Bajwa, Blue Bell, PA (US);

Thomas J. Colosimo, Jr., West Chester, PA (US);

Assignee:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81801 (2013.01);
Abstract

A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.


Find Patent Forward Citations

Bajwa, Adeel. (2021). Methods of bonding of semiconductor elements to substrates, and related bonding systems (U.S. Patent No. 11205633). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11205633

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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