The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Sep. 25, 2018
Applicant:

Schott Ag, Mainz, DE;

Inventors:

Helmut Hartl, Vienna, AT;

Reinhard Ranftl, Pfeffenhausen, DE;

Assignee:

Schott AG, Mainz, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/045 (2006.01); B23K 1/20 (2006.01); H01L 23/488 (2006.01); H01L 23/492 (2006.01); H01L 23/10 (2006.01); B23K 1/00 (2006.01); H01L 23/14 (2006.01); H01L 23/29 (2006.01); H01R 4/02 (2006.01); B23K 101/38 (2006.01);
U.S. Cl.
CPC ...
H01L 23/492 (2013.01); B23K 1/0008 (2013.01); B23K 1/20 (2013.01); H01L 23/045 (2013.01); H01L 23/10 (2013.01); H01L 23/142 (2013.01); H01L 23/291 (2013.01); H01R 4/02 (2013.01); B23K 2101/38 (2018.08); H01R 4/028 (2013.01);
Abstract

The present disclosure relates to components, such as base bodies, for feed-through elements including a metallic base body, at least one through-opening for receiving a functional element in a fixing material, such as an electrically insulating fixing material, and at least one conductor, which is connected electrically conductively to the base body by a soldered connection. The soldered connection includes a metallic solder material that covers a surface region of the base body and thus forms a soldering region on a surface of the base body. The base body has, at least in the soldering region, a microstructuring that includes at least depressions in the surface of the base body. The present disclosure similarly relates to methods for producing such base bodies and to applications thereof.


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