The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Jan. 20, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Eung chang Lee, Daejeon, KR;
Heeyoub Kang, Seoul, KR;
Haejung Yang, Suwon-si, KR;
Youngrok Oh, Seoul, KR;
Kitaek Lee, Hwaseong-si, KR;
Bong jae Lee, Daejeon, KR;
Assignees:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Korea Advanced Institute Of Science And Technology, Daejeon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); C08G 77/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/296 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/367 (2013.01); C08G 77/04 (2013.01);
Abstract
A semiconductor package includes a semiconductor chip and a polydimethylsiloxane (PDMS) layer that is provided on the semiconductor chip and of which upper surface is exposed to the outside. Since the semiconductor package may include the PDMS layer, heat emitting performance of the semiconductor package in a vacuum state may improve.