The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Apr. 01, 2020
Applicant:
Wuhan Tianma Micro-electronics Co., Ltd., Wuhan, CN;
Assignee:
Wuhan Tianma Micro-Electronics Co., Ltd., Wuhan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); G06K 7/10 (2006.01); G06K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0412 (2013.01); G06K 7/1093 (2013.01); G06K 9/0002 (2013.01); G06K 9/00013 (2013.01); H05K 1/0259 (2013.01); H05K 1/11 (2013.01); H05K 1/113 (2013.01); H05K 1/114 (2013.01); H05K 1/118 (2013.01); H05K 1/144 (2013.01); H05K 1/189 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/1388 (2013.01);
Abstract
The present disclosure provides a flexible circuit board. The flexible circuit board includes a substrate; a conductive layer, disposed on the substrate; and a cover layer, disposed on a side of the conductive layer facing away from the substrate. The flexible circuit board is provided with a through hole penetrating through the flexible circuit board in the thickness direction. The cover layer includes a hollowed-out region located at least at an edge of one side of the through hole. The conductive layer includes an electrostatic discharge section exposed in the hollowed-out region.