The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Jul. 21, 2017
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, KR;
Inventors:
Hyeonil Jung, Suwon-si, KR;
Sunghwan Kim, Suwon-si, KR;
Seunghyun Kim, Suwon-si, KR;
Yushin Park, Suwon-si, KR;
Jaebum Lim, Suwon-si, KR;
Assignee:
SAMSUNG SDI CO., LTD., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 61/12 (2006.01); H01L 21/033 (2006.01); H01L 21/027 (2006.01); H01L 21/02 (2006.01); C08G 61/10 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); C09D 165/00 (2006.01); C08G 61/02 (2006.01); G03F 7/09 (2006.01); G03F 7/00 (2006.01); H01L 21/3213 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
C08G 61/124 (2013.01); C08G 61/02 (2013.01); C08G 61/10 (2013.01); C08G 61/12 (2013.01); C09D 165/00 (2013.01); G03F 7/00 (2013.01); G03F 7/09 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); H01L 21/027 (2013.01); H01L 21/0276 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/033 (2013.01); H01L 21/0332 (2013.01); C08G 2261/11 (2013.01); C08G 2261/148 (2013.01); C08G 2261/1414 (2013.01); C08G 2261/1422 (2013.01); C08G 2261/228 (2013.01); C08G 2261/314 (2013.01); C08G 2261/3241 (2013.01); H01L 21/3081 (2013.01); H01L 21/31144 (2013.01); H01L 21/32139 (2013.01);
Abstract
Disclosed are a polymer including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, an organic layer composition including the polymer, and a method of forming patterns using the organic layer composition. The Chemical Formulae 1 and 2 are the same as defined in the specification.