The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Jan. 16, 2018
Applicant:
Sekisui Chemical Co., Ltd., Osaka, JP;
Inventors:
Juichi Fukatani, Osaka, JP;
Takazumi Okabayashi, Osaka, JP;
Kozo Nakamura, Osaka, JP;
Atsushi Wada, Osaka, JP;
Hiroyuki Nakatani, Osaka, JP;
Assignee:
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/00 (2006.01); B32B 3/26 (2006.01); B32B 7/12 (2006.01); B32B 17/10 (2006.01); B32B 27/30 (2006.01); C09J 7/10 (2018.01); C09J 129/14 (2006.01); B32B 7/023 (2019.01); B32B 5/14 (2006.01); G02F 1/1333 (2006.01); G06F 3/041 (2006.01); B32B 17/04 (2006.01); C09J 11/00 (2006.01); B32B 27/06 (2006.01); B32B 27/04 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 1/00 (2013.01); B32B 3/263 (2013.01); B32B 5/142 (2013.01); B32B 7/023 (2019.01); B32B 17/10 (2013.01); B32B 17/10018 (2013.01); B32B 17/1066 (2013.01); B32B 17/10568 (2013.01); B32B 17/10761 (2013.01); B32B 17/10935 (2013.01); B32B 27/306 (2013.01); C09J 7/10 (2018.01); C09J 129/14 (2013.01); B32B 17/04 (2013.01); B32B 17/10036 (2013.01); B32B 17/10697 (2013.01); B32B 17/10706 (2013.01); B32B 17/10743 (2013.01); B32B 17/10788 (2013.01); B32B 27/04 (2013.01); B32B 27/06 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2307/40 (2013.01); B32B 2307/4026 (2013.01); B32B 2307/412 (2013.01); B32B 2307/418 (2013.01); B32B 2307/51 (2013.01); B32B 2307/56 (2013.01); B32B 2329/00 (2013.01); B32B 2329/06 (2013.01); B32B 2457/20 (2013.01); B32B 2457/208 (2013.01); B32B 2551/00 (2013.01); C09J 11/00 (2013.01); G02F 1/133331 (2021.01); G06F 2200/1634 (2013.01); Y10T 428/24479 (2015.01); Y10T 428/24521 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/24777 (2015.01);
Abstract
The present invention aims to provide a filling-bonding material that is suitably used to fill a space between parts, while bonding the parts, in optical devices in various shapes not limited to flat shapes. The present invention also aims to provide a protective sheet-equipped filling-bonding material, a laminate, an optical device, and a protective panel for an optical device each including the filling-bonding material. Provided is a filling-bonding material having a shape with an uneven thickness.