The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Jul. 03, 2019
Applicant:

Samsung Display Co., Ltd., Yongin-Si, KR;

Inventors:

Sukju Kang, Suwon-si, KR;

Byung-moo Kim, Suwon-si, KR;

Geunyoung Yu, Cheonan-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B32B 27/00 (2006.01); B29C 65/00 (2006.01); B32B 3/04 (2006.01); B29C 65/70 (2006.01); B29C 65/48 (2006.01); B32B 27/08 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
B32B 3/04 (2013.01); B29C 65/48 (2013.01); B29C 65/70 (2013.01); B29C 66/81264 (2013.01); B29C 66/81455 (2013.01); B29C 66/83221 (2013.01); B29C 66/90 (2013.01); B32B 27/08 (2013.01); B32B 2457/20 (2013.01); H05K 5/0017 (2013.01);
Abstract

A bonding device includes an upper chamber a pad with which a display substrate is pressable to a substrate; a stage between a lower chamber and the pad and including an opening through which air is introduced; a molding member between an upper chamber and the pad and surrounding the pad and the opening; and a support member connected to the stage The display substrate disposed on the molding member disposes first and second portions of the display substrate overlapping the planar and bending portions of the substrate, respectively, the molding member presses the first portion to the planar portion, and air introduced through the opening, expands the molding member to press the second portion to the bending portion.


Find Patent Forward Citations

Loading…