The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Jul. 09, 2018
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
Sami M. El-Soudani, Cherritos, CA (US);
Daniel Gordon Sanders, Lake Tapps, WA (US);
Shinichi Yajima, Utsunomiya, JP;
Assignees:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/00 (2021.01); B22F 3/04 (2006.01); B22F 3/02 (2006.01); B22F 3/12 (2006.01); B30B 11/00 (2006.01); B22F 1/00 (2006.01); B22F 3/16 (2006.01); C22C 14/00 (2006.01);
U.S. Cl.
CPC ...
B22F 3/04 (2013.01); B22F 1/0003 (2013.01); B22F 3/003 (2013.01); B22F 3/02 (2013.01); B22F 3/1216 (2013.01); B22F 3/16 (2013.01); B30B 11/00 (2013.01); B30B 11/001 (2013.01); C22C 14/00 (2013.01); B22F 2301/205 (2013.01); B22F 2998/10 (2013.01);
Abstract
Crack-free powder-based, near net shaped parts are fabricated using a die assembly and cold isostatic pressing. Soft materials are introduced on both sides of die components in order to balance compression loads applied to the die component, and thereby avoid deformation of the die component.