The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Aug. 18, 2016
Applicant:

Schreiner Group Gmbh & Co. KG, Oberschleissheim, DE;

Inventor:

Johannes Becker, Ilmmuenster, DE;

Assignee:

Schreiner Group GmbH & Co. KG, Oberschleissheim, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01); A61F 13/42 (2006.01); A61J 1/03 (2006.01); B65D 75/36 (2006.01); G01N 27/22 (2006.01); H05K 1/18 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); A61F 13/42 (2013.01); A61J 1/035 (2013.01); B65D 75/367 (2013.01); G01N 27/223 (2013.01); H05K 1/0239 (2013.01); H05K 1/147 (2013.01); H05K 1/18 (2013.01); A61F 2013/424 (2013.01); A61J 2200/70 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 2201/049 (2013.01); H05K 2201/055 (2013.01); H05K 2201/056 (2013.01); H05K 2201/09663 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10681 (2013.01);
Abstract

An object has a first conductor structure, an electronic unit, a second conductor structure galvanically isolated from the first conductor structure and/or from the electronic unit but coupleable electrically thereto, and a carrier structure with a first pliable carrier layer having a first carrier layer region and with a second carrier layer region. The carrier structure is a layer stack in a base surface region including at least part of the carrier structure base surface and includes at least the first and second carrier layer regions. At least part of the conductor structures is in the base surface region. The first conductor structure and/or the electronic unit is joined with the first carrier layer region. The second conductor structure is joined with the second carrier layer region and coupleable electrically to the first conductor structure and/or the electronic unit by a layer stack surface region outside the electronic unit.


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