The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Jan. 22, 2021
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventor:
Takashi Watanabe, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/04 (2006.01); H03F 3/195 (2006.01); H03F 3/24 (2006.01); H04B 1/00 (2006.01);
U.S. Cl.
CPC ...
H04B 1/04 (2013.01); H03F 3/195 (2013.01); H03F 3/245 (2013.01); H04B 1/0042 (2013.01); H03F 2200/451 (2013.01); H04B 2001/0408 (2013.01);
Abstract
A radio frequency module has a substrate, a first chip inductor, an integrated circuit, and a first amplifier connected to the first chip inductor. The first chip inductor is on a first main surface of the substrate and the integrated circuit is on a second main surface of the substrate, the second main surface being opposite the first main surface. The integrated circuit includes the first amplifier. When the substrate is viewed from a direction perpendicular to the first main surface of the substrate, the first chip inductor at least partially overlaps the integrated circuit.