The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Dec. 04, 2019
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jungmin Park, Gyeonggi-do, KR;

Chih Wei Lee, Gyeonggi-do, KR;

Chonghwa Seo, Gyeonggi-do, KR;

Sungcheol Yoo, Gyeonggi-do, KR;

Jongwon Lee, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/52 (2006.01); H01Q 21/06 (2006.01); H01Q 21/00 (2006.01); H01Q 1/24 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/526 (2013.01); H01Q 1/246 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/065 (2013.01);
Abstract

An antenna module comprises a printed circuit board, a communication circuit disposed on a first surface of the printed circuit board, an array antenna configured to transmit/receive a signal in a specified high-frequency band with the communication circuit, wherein the array antenna includes, first conductive elements disposed on the first surface of the printed circuit board, and second conductive elements disposed on a second surface facing the first conductive elements, and a first molding layer covering the first conductive elements.


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