The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Apr. 16, 2019
Applicant:
Samsung Display Co., Ltd., Yongin-si, KR;
Inventors:
Ki-Soo Nam, Asan-si, KR;
Gi Young Kang, Cheonan-si, KR;
Assignee:
SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3255 (2013.01); H01L 23/3185 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 24/16 (2013.01); H01L 27/3276 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1426 (2013.01);
Abstract
A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.