The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Mar. 25, 2020
Applicant:

SK Hynix Inc., Icheon-si, KR;

Inventor:

Sun Myung Choi, Seoul, KR;

Assignee:

SK hynix Inc., Icheon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); H01L 27/06 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); G11C 8/12 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0688 (2013.01); G11C 5/025 (2013.01); G11C 5/063 (2013.01); G11C 7/10 (2013.01); G11C 7/1006 (2013.01); G11C 7/109 (2013.01); G11C 7/1087 (2013.01); G11C 8/12 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 25/0657 (2013.01);
Abstract

A semiconductor device includes a master chip and a first slave chip. The master chip outputs a write signal or read signal and a chip identification (ID) signal and outputs data through a transmitter activated by the write signal or receives data through a receiver activated by the read signal. The first slave chip enters a write operation according to the write signal and activates a first receiver to store the data when the chip ID signal has a first logic level combination. The first slave chip enters a read operation according to the read signal and configured to activate a first transmitter to output the data when the chip ID signal has a first logic level combination. The master chip and the first slave chip are vertically stacked and are electrically connected to each other by a plurality of through electrodes penetrating the first slave chip.


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