The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Jul. 26, 2019
Applicant:

Nxp B.v., Eindhoven, NL;

Inventor:

Olivier Tesson, Bretteville l'Orgueilleuse, FR;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 21/768 (2013.01); H01L 23/528 (2013.01);
Abstract

An integrated circuit comprising a semiconductor substrate and a passive coupler located on the substrate. The coupler includes a solenoid. The coupler also includes a signal line passing through the solenoid. A method of making an integrated circuit. The method includes providing a semiconductor substrate and forming a passive coupler in a metallization stack on the substrate. Forming the passive coupler in the metallization stack on the substrate includes forming one or more windings of the solenoid using patterned metal features in a plurality of metal layers of the metallization stack. Forming the passive coupler in the metallization stack on the substrate also includes forming a signal line using one or more patterned metal features in one or more metal layers of the metallization stack. The signal line passes through the solenoid.


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