The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Mar. 04, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ki Ju Lee, Suwon-si, KR;
Gyo Young Jung, Su-won-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package mounted board includes a printed circuit board on which a plurality of first pads and a plurality of second pads are disposed on one surface, and a semiconductor package disposed on the one surface of the printed circuit board and including a plurality of third pads and a plurality of fourth pads. A plurality of first electrical connection structures electrically connect the plurality of first pads and the plurality of third pads, and one or more second electrical connection structures electrically connect the plurality of second pads and the plurality of fourth pads. The plurality of first pads are disposed to correspond to and overlap/align with the plurality of third pads from each other, and the plurality of second pads are disposed to be staggered and offset with respect to the plurality of fourth pads.