The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Mar. 06, 2019
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventor:

Noriyuki Isobe, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01); C23C 16/44 (2006.01); C23C 16/458 (2006.01); C23C 16/40 (2006.01); H01L 21/285 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0228 (2013.01); C23C 16/405 (2013.01); C23C 16/4408 (2013.01); C23C 16/4412 (2013.01); C23C 16/455 (2013.01); C23C 16/4584 (2013.01); C23C 16/45527 (2013.01); C23C 16/45546 (2013.01); C23C 16/45578 (2013.01); C23C 16/52 (2013.01); H01J 37/3244 (2013.01); H01L 21/02186 (2013.01); H01L 21/02697 (2013.01); H01L 21/28556 (2013.01); H01L 21/324 (2013.01); H01L 21/67017 (2013.01); H01L 21/67098 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01);
Abstract

According to one aspect of the technique described herein, there is provided a technique including: forming a film on a substrate by performing a cycle a predetermined number of times, wherein the cycle includes sequentially performing: (a) supplying source gas to a substrate accommodated in a reaction tube; (b) exhausting the source gas remaining in the reaction tube through an exhaust pipe connected to the reaction tube; (c) supplying a reactive gas reacting with the source gas to the substrate; and (d) exhausting the reactive gas remaining in the reaction tube through the exhaust pipe, wherein at least in (a) and (c), a temperature of the reaction tube is set to a first temperature lower than a thermal decomposition temperature of the source gas and higher than a condensation temperature of the source gas and a temperature of the exhaust pipe is set to a second temperature equal to or higher than the first temperature.


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