The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Jun. 30, 2020
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Takehisa Sasabayashi, Nagaokakyo, JP;
Kenjiro Gomi, Nagaokakyo, JP;
Kenji Kimura, Nagaokakyo, JP;
Wataru Oshima, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Abstract
A multilayer electronic component having a plurality of laminated dielectric layers and inner electrode layers. The dielectric layers have a plurality of crystal grains including first regions where Re is dissolved in a solid state; and second regions where Re is not dissolved in the solid state. A median size of the crystal grains to an average thickness of the dielectric layers is 0.5≤t≤0.7. A ratio of a sum of cross sectional areas of the first regions to those of the plurality of crystal grains is 0.7≤s≤0.9. When a total amount of Ti, Zr, and Hf is 100 molar parts in the dielectric layers, a sum of the Zr and the Hf is 0≤a≤1.0; an amount b of Si is 0.1≤b≤1.0; an amount c of Re is 0.5≤c≤10.0; and a ratio m of a total of Ba and Re to a total of Ti, Zr, and Hf is 0.990≤m≤1.050.