The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Dec. 06, 2019
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Jun Nishikawa, Tokyo, JP;
Yasutomo Suga, Tokyo, JP;
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/005 (2006.01); H05K 1/18 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/005 (2013.01); H01G 4/1227 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01);
Abstract
A multi-layer ceramic electronic component that satisfies the following: 30 μm≤Ts≤100 μm, 6 μm≤T≤18 μm, and 0.19≤(2T+t)/Ts≤1.55, where Ts represents a dimension of a ceramic body measured along a first axis, T represents a mean value of thickness dimensions of upper and lower portions of an external electrode measured along the first axis that cover edges of top and bottom surfaces of the ceramic body, and t represents a sum of thickness dimensions of internal electrodes drawn to and in contact with the external electrode.