The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Oct. 01, 2018
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;

Inventors:

Kyoung Jin Cha, Suwon-Si, KR;

Seung Heui Lee, Suwon-Si, KR;

Hyun Soo Oh, Suwon-Si, KR;

Hyung Soon Kwon, Suwon-si, KR;

Ji Hong Jo, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/012 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01);
U.S. Cl.
CPC ...
H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01);
Abstract

A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet containing a ceramic powder and forming an internal electrode pattern on the ceramic green sheet using a conductive paste containing conductive metal particles and an additive. A ceramic laminate is formed by stacking the ceramic green sheets on which the internal electrode pattern is formed. A ceramic body including dielectric layers and internal electrodes is formed by sintering the ceramic laminate. An average number of conductive metal particles in the internal electrode pattern in a thickness direction is more than 2 and 5 or less.


Find Patent Forward Citations

Loading…