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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11201007 B1

PDFFull Text
Date of Patent:
Dec. 14, 2021

Filed:

Nov. 11, 2019

Modulated inductance module

Applicant:

L. Pierre DE Rochemont, Raleigh, NC (US);

Inventor:

L. Pierre de Rochemont, Raleigh, NC (US);

Assignee:

Other;

Attorneys:

Burns & Levinson LLP

Jerry Cohen

Joseph P. Quinn

Primary Examiner:

Tszfung J Chan

Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01F 27/24 (2006.01); H01G 4/33 (2006.01); H01C 17/065 (2006.01); H05K 1/16 (2006.01); H01G 4/10 (2006.01); H01C 17/00 (2006.01); H01C 7/00 (2006.01); B82Y 30/00 (2011.01); H01L 23/64 (2006.01); H01F 3/00 (2006.01); H01F 5/00 (2006.01); H01F 27/29 (2006.01); H01F 27/40 (2006.01); H01L 49/02 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); B82Y 30/00 (2013.01); H01C 7/003 (2013.01); H01C 17/003 (2013.01); H01C 17/06533 (2013.01); H01F 3/00 (2013.01); H01F 5/003 (2013.01); H01F 27/24 (2013.01); H01F 27/29 (2013.01); H01F 27/40 (2013.01); H01F 41/041 (2013.01); H01G 4/10 (2013.01); H01G 4/33 (2013.01); H01L 23/64 (2013.01); H01L 28/10 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 1/167 (2013.01); C04B 2235/768 (2013.01); C04B 2235/781 (2013.01); H01F 2027/2809 (2013.01); H01L 2224/16 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01021 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01037 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01067 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H05K 1/0298 (2013.01); H05K 1/092 (2013.01); H05K 3/207 (2013.01); H05K 2201/017 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/09763 (2013.01); H05K 2203/016 (2013.01); H05K 2203/0338 (2013.01); H05K 2203/121 (2013.01); Y10T 29/49021 (2015.01);
Abstract

A modulated inductance module includes an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element formed on a semiconductor die, wherein the inductor further has two or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout said ceramic element, the ceramic element has crystalline grain structure having a diameter that is less than or equal to 1.5× a mean grain diameter, and the semiconductor die contains active semiconductor switches or rectifying components that are in electrical communication with the one or more electrical conductors of the inductor.

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