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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11199776 B1

PDFFull Text
Date of Patent:
Dec. 14, 2021

Filed:

Jul. 25, 2017

Resin composition

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Yusuke Komori, Otsu, JP;

Kazuto Miyoshi, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP.

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/038 (2006.01); G03F 7/40 (2006.01); H01L 23/29 (2006.01); G03F 7/20 (2006.01); C07C 233/80 (2006.01); C08G 73/10 (2006.01); C07C 233/44 (2006.01); C08G 73/22 (2006.01); H05B 33/10 (2006.01); H01L 27/32 (2006.01); C08L 101/02 (2006.01); H01L 51/50 (2006.01); C08L 79/08 (2006.01); H05B 33/22 (2006.01); G03F 7/004 (2006.01); G03F 7/022 (2006.01); C08K 5/20 (2006.01); C07C 233/43 (2006.01); C07C 237/40 (2006.01); C08J 5/18 (2006.01); G03F 7/039 (2006.01); G03F 7/16 (2006.01); G03F 7/30 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 27/12 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0387 (2013.01); C07C 233/43 (2013.01); C07C 233/44 (2013.01); C07C 233/80 (2013.01); C07C 237/40 (2013.01); C08G 73/106 (2013.01); C08G 73/1007 (2013.01); C08G 73/1039 (2013.01); C08G 73/1046 (2013.01); C08G 73/1067 (2013.01); C08G 73/22 (2013.01); C08J 5/18 (2013.01); C08K 5/20 (2013.01); C08L 79/08 (2013.01); C08L 101/02 (2013.01); G03F 7/004 (2013.01); G03F 7/023 (2013.01); G03F 7/0226 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/2004 (2013.01); G03F 7/30 (2013.01); G03F 7/40 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 23/544 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 27/1248 (2013.01); H01L 27/32 (2013.01); H01L 27/3258 (2013.01); H01L 51/0018 (2013.01); H01L 51/0035 (2013.01); H01L 51/50 (2013.01); H01L 51/56 (2013.01); H05B 33/10 (2013.01); H05B 33/22 (2013.01); C08J 2379/08 (2013.01); H01L 2223/5446 (2013.01); H01L 2224/024 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/13024 (2013.01);
Abstract

The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO)—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO)—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.

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