The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Oct. 08, 2018
Applicant:

Smith International, Inc., Houston, TX (US);

Inventors:

Yi Fang, Orem, UT (US);

J. Daniel Belnap, Lindon, UT (US);

Scott L. Horman, Provo, UT (US);

Ryan Davis, Pleasant Grove, UT (US);

Haibo Zhang, Lindon, UT (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 10/567 (2006.01); E21B 10/08 (2006.01);
U.S. Cl.
CPC ...
E21B 10/567 (2013.01); E21B 10/08 (2013.01);
Abstract

A cutting element has an intercrystalline-bonded diamond body that includes an inner region and an outer surface that includes a working surface of the cutting element. The outer surface is treated, after formation of the intercrystalline-bonded diamond by high-pressure/high-temperature process, to have a level of surface compressive stress that is greater than a compressive stress of the inner region.


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