The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Nov. 20, 2017
Applicant:

Sumco Corporation, Tokyo, JP;

Inventors:

Masayuki Tsuji, Tokyo, JP;

Motonori Nakamura, Tokyo, JP;

Assignee:

SUMCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/18 (2006.01); C30B 25/16 (2006.01); H01L 21/203 (2006.01);
U.S. Cl.
CPC ...
C30B 25/18 (2013.01); C30B 25/165 (2013.01); H01L 21/2033 (2013.01);
Abstract

Provided is a method of producing an epitaxial silicon wafer, which is excellent in productivity and prevents the formation of a backside haze in consecutive single-wafer processing epitaxial growth procedures on a plurality of silicon wafers without cleaning a process chamber after each epitaxial growth procedure. The method of producing an epitaxial silicon wafer includes: a step of loading a silicon wafer; a step of forming a silicon epitaxial layer; a step of unloading the silicon wafer; and a cleaning step. The cleaning step is performed before and after repeating a predetermined number of times a series of growth procedures including the silicon wafer loading step, the silicon epitaxial layer formation step, and the silicon wafer unloading step.


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