The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

May. 31, 2016
Applicant:

Dow Global Technologies Llc, Midland, MI (US);

Inventors:

Woo-Sung Bae, Northville, MI (US);

Justin M. Virgili, Oakland, CA (US);

Mark F. Sonnenschein, Midland, MI (US);

Jonathan Barrus, Lake Jackson, TX (US);

Yinzhong Guo, Pearland, TX (US);

Rui Xie, Pearland, TX (US);

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 175/04 (2006.01); B32B 7/12 (2006.01); C08G 18/50 (2006.01); C08G 18/32 (2006.01); B32B 7/00 (2019.01); B32B 27/28 (2006.01); B32B 27/40 (2006.01); C08G 18/40 (2006.01); C09J 175/02 (2006.01); C09J 175/00 (2006.01);
U.S. Cl.
CPC ...
C09J 175/04 (2013.01); B32B 7/00 (2013.01); B32B 7/12 (2013.01); B32B 27/28 (2013.01); B32B 27/40 (2013.01); C08G 18/3243 (2013.01); C08G 18/4018 (2013.01); C08G 18/5027 (2013.01); C09J 175/00 (2013.01); C09J 175/02 (2013.01); B32B 2405/00 (2013.01);
Abstract

A process comprising a) mixing i) an isocyanate reactive component that contains from 2 to 100 weight percent of an aminobenzoate terminated composition wherein the isocyanate reactive component does not contain a solvent; and ii) an isocyanate terminated component having an isocyanate functionality of from 2 to 6 wherein the isocyanate terminated component does not contain a solvent; at a stoichiometric ratio of NCO to reactive hydrogen in the range of from 0.9 to 2.5; to form an adhesive composition; b) applying the adhesive composition to a primary substrate; and c) laminating the primary substrate with a secondary film to form a laminate structure, is disclosed. The laminate structure can be used as a laminating adhesive.


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