The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Apr. 05, 2018
Applicant:

Heedae Park, Busan, KR;

Inventor:

Heedae Park, Busan, KR;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/35 (2018.01); C09J 7/40 (2018.01); C09J 7/10 (2018.01); B05D 5/10 (2006.01); C08G 18/80 (2006.01); C09J 5/06 (2006.01); C09J 11/04 (2006.01); C09J 175/04 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); B05D 5/10 (2013.01); C08G 18/807 (2013.01); C08G 18/8074 (2013.01); C08G 18/8077 (2013.01); C08G 18/8093 (2013.01); C09J 5/06 (2013.01); C09J 7/10 (2018.01); C09J 7/405 (2018.01); C09J 11/04 (2013.01); C09J 175/04 (2013.01); C08G 2170/20 (2013.01); C08G 2170/80 (2013.01); C08K 3/36 (2013.01); C08K 2201/011 (2013.01); C09J 2301/304 (2020.08); C09J 2301/408 (2020.08); C09J 2400/10 (2013.01); C09J 2475/00 (2013.01);
Abstract

Disclosed is a composition for reactive hot melt resin and a reactive hot melt film prepared from the resin, which resin composition includes a polyurethane resin having a linear structure, an isocyanate blocking agent having a plurality of functional groups, a reaction catalyst, a reaction retardant, etc. Preferably, the resin composition includes a polyurethane resin and an isocyanate blocking agent used as a latent curing agent, which are main components; a catalyst for accelerating the reaction; and a reaction retardant for securing long-term storability. Particularly, the composition for reactive hot melt resin further includes a heat-resistance enhancer, preferably nanosilica, for preventing the resin from melting down during no-sew press treatment to provide a performance to help maintenance of adhesion.


Find Patent Forward Citations

Loading…